Designing a PCB with DEX > Parts > PCB Device Types > Device Package Types > PCB Device Packages

Integrated Circuits (ICs) come in a wide variety of packages, each designed to address different requirements in terms of pin count, thermal management, size constraints, and application purposes.

Here is an extensive list of IC packages:

•BGA - Ball Grid Array

•BCC - Bump Chip Carrier

•BQFP - Bumpered Quad Flat Pack

•CABGA/SSBGA - Chip Array/Small Scale Ball Grid Array

•CBGA - Ceramic Ball Grid Array

•CCGA - Ceramic Column Grid Array

•CERPACK - Ceramic Package

•CGA - Column Grid Array

•CFP - Ceramic Flat Pack

•CLCC - Ceramic Leadless Chip Carrier Packages

•CLGA - Ceramic Land Grid Array

•CQFP - Ceramic Quad Flat Pack

•CSBGA - Cavity Down BGA

•CSOP - Ceramic Small Outline Package

•CSP BGA - Chip Scale Package BGA

•DBS - DIL Bent SIL

•DFN - Dual Flat Pack, No Lead

•DLCC - Dual Lead-Less Chip Carrier (Ceramic)

•DMP - Dual In-line Mini Molded Package

•DQFN - Depopulated Quad Flat-pack; No-leads

•EPTSSOP - Thin Shrink Small Outline Exposed Pad Plastic Packages

•ETQFP - Extra Thin Quad Flat Package

•FBGA - Fine-pitch Ball Grid Array

•FCBGA - Flip-chip BGA

•FCPBGA - Flip-chip Plastic BGA

•FFP - Flip-chip Fine Package

•FleXBGA - Flexible Ball Grid Array

•FLP - Flat Lead Package

•FPBGA - Fine Pitch Ball Grid Array

•HBCC - Heat-sink Bottom Chip Carrier

•HBGA - High Performance Ball Grid Array

•JDIP - J-Leaded Dual In-Line J-Lead DIP Picture

•JLCC - J-Leaded Chip Carrier (Ceramic) J-Lead Picture

•LBGA - Low-Profile Ball Grid Array

•LCC - Leaded Chip Carrier

•LCGA - Low-Profile Ball Grid Array

•LFBGA - Low-Profile, Fine-Pitch Ball Grid Array

•LGA - Land Grid Array

•LLCC - Leadless Chip Carrier

•LQFP - Low-profile Quad Flat pack

•MCMBGA - Multi Chip Module Ball Grid Array

•MLCC - Micro Lead-frame Chip Carrier

•MLP - Micro Lead-frame Package

•MQFP - Metric Quad Flat Pack (high pin count QFP)

•MSOP - Mini Small Outline Plastic Packages

•OBGA - Organic Ball Grid Array

•PBGA - Plastic Ball Grid Array

•PLCC - Plastic Leaded Chip Carrier

•POS Package on Substrate

•PQFP Plastic Quad Flat Pack

•PSOP Plastic Small-Outline Package

•QFN Quad Flat No-Lead

•QFP Quad Flat pack

•QSOP Quarter Size Outline Package

•SBGA Super BGA - above 500 Pin count

•SO Flat Pack - Small Outline Flat Pack IC

•SOIC - Small Outline IC

•SOJ - Small-Outline Package (J-Lead)

•SON - Small-Outline No-leads (leadless package)

•SOP - Small Outline Package

•SSOP - Shrink Small-Outline Package

•SOT - Small Outline Transistor Plastic Package

•TBGA - Tape Ball Grid Array

•TBGA - Thin Ball Grid Array

•TDFN - Thin Dual Flat No-Lead Plastic Package

•TEPBGA - Thermally Enhanced Plastic Ball Grid Array

•TQFN - Thin Quad Flat No-Lead Plastic Package

•TQFP - Thin Quad Flat Pack

•TSOP - Thin Small-Outline Package

•TSSOP - Thin Shrink Small-Outline Package

•TSOT - Thin Small Outline Transistor Plastic Package

•TVSOP - Thin Very Small-Outline Package

•TVSP - Thin Very Small Package

•UFBGA - Ultra Fine-Line BGA

•UTDFN - Ultra Thin Dual Flat No-Lead Plastic Package

•VFBGA - Very thin Fine-pitch Ball Grid Array

•VQFB - Very-thin Quad Flat Pack

•VSO - Very Small Outline

•VSSOP - Very Thin Shrink Small Outline Package

•VSP - Very Small Package

•XQFN - eXtremely Thin Quad Flat package; No leads

•XSON - eXtremely thin Small Outline package; No leads

With the continuing advancement in electronics and semiconductor technology, the trend in IC packaging is moving towards smaller, more efficient packages that can support higher levels of integration and performance. Factors like heat dissipation, signal integrity, size constraints, and cost all play a significant role in determining the best packaging type for a particular application.

Advanced and Emerging IC Packaging Types