<< Click to Display Table of Contents >> Navigation:  Designing a PCB with DEX > Parts > PCB Device Types > Device Package Types > PCB Device Packages > Integrated Circuits > CERPACK - Ceramic Package

CERPACK is a term that refers to a variety of ceramic packages used in semiconductor devices. These ceramic packages are used for a wide range of semiconductor devices, from simple integrated circuits (ICs) to more complex microprocessors. Ceramic materials are chosen for these packages due to their excellent thermal properties, mechanical strength, and chemical stability.

Structure

•Ceramic Body: CERPACKs are made with a ceramic material (often alumina or aluminum nitride) that can withstand high temperatures, providing excellent thermal conductivity and electrical insulation.

•Die Attachment: The semiconductor die is attached inside the ceramic package, usually with a high-thermal-conductivity adhesive to ensure efficient heat dissipation. The die is then wire-bonded to the lead frame or conductive pads of the package.

•Sealing: After the die is attached and connected, the package is sealed to protect the semiconductor device from environmental factors like moisture, dust, and mechanical shocks. This can be done with a ceramic lid, often using a glass frit for hermetic sealing, or with a glob-top encapsulant in less demanding environments.

Advantages

•Thermal Management: Ceramic materials have superior thermal characteristics compared to plastics, enabling devices to operate at higher power levels or in higher ambient temperatures without overheating.

•Mechanical Strength: Ceramic packages are robust and resistant to physical stress, making them suitable for demanding applications, including military and aerospace environments.

•Chemical Stability: They are resistant to most solvents, acids, and bases, ensuring the package won't degrade in harsh chemical environments.

•Hermeticity: Ceramic packages can be hermetically sealed, protecting sensitive semiconductor devices from humidity, gases, and other environmental conditions that could adversely affect their performance.

Applications

•Aerospace and Defense: Given their resilience and reliability, ceramic packages are commonly used in military hardware and space applications where components must endure extreme conditions.

•Automotive Industry: High-reliability applications in automotive electronics, such as engine control units, often use ceramic packaging for its superior performance in hot, high-vibration environments.

•Telecommunications: Certain high-frequency semiconductor devices used in communication infrastructure benefit from the low electrical loss characteristics of ceramic materials.

•Medical Devices: The non-reactivity and reliability of ceramic packages are advantageous in medical electronics, especially those used within or in close proximity to the human body.

Considerations

•Cost: Due to the material properties and manufacturing complexities, ceramic packages are generally more expensive than their plastic counterparts. They are thus reserved for applications that require their specific advantages.

•Design Constraints: The physical characteristics of ceramic materials require particular design and handling considerations during the package assembly process. For instance, ceramic is more brittle than plastic, requiring careful mechanical handling.

•Thermal Considerations: While ceramic is excellent for dissipating heat, devices that generate significant heat may still require additional thermal management strategies to keep the die at an operational temperature.

In conclusion, CERPACK refers to a family of ceramic-based semiconductor packages offering numerous benefits in terms of thermal management, mechanical strength, and environmental resistance. Their use is essential in sectors where reliability and resilience are of utmost importance, despite their higher cost compared to plastic packages.