Ball Grid Array (BGA) is a type of surface-mount packaging used for integrated circuits (ICs). BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than dual in-line or flat packages.
Here are some characteristics of BGA ICs:
•Design: The bottom of the BGA is covered in solder balls (hence the name "Ball Grid Array"). These solder balls are placed at the locations where the IC needs to make electrical contact with the PCB. The solder balls are melted to attach the IC to the PCB, making both electrical and mechanical connections.
•High Density: Because the entire bottom of the BGA can be used for connections, it can accommodate a larger number of pins within the same space compared to packages that only have pins around the edge. This high density makes BGA a good choice for complex, high-performance ICs like microprocessors and FPGAs.
•Better Performance: The shorter and more direct paths between the IC and the PCB provided by the BGA design can result in better electrical and thermal performance compared to other packages.
•Soldering and Inspection: BGA packages can be harder to solder correctly compared to other packages, due to the fact that the solder balls are hidden underneath the IC. Specialized equipment is needed for both the soldering and inspection process.
•Rework and Repair: BGA packages are also challenging to rework or repair. If a solder joint fails or the IC needs to be replaced, specialized equipment and skills are required.
BGA ICs are commonly used in applications that require high performance and a large number of interconnections, such as in servers, networking equipment, high-end consumer electronics, and more.
To create a BGA part click the 
button in The Part Builder
The part builder will automatically create the footprint for the device and also a suitable schematic symbol with the pin names left blank for you to fill in.