Designing a PCB > Parts > Creating Parts > Footprints/Land Patterns > BGA

BGA (Ball Grid Array) is a family of surface-mount IC packages that use an array of solder balls underneath the package body to provide electrical and mechanical connections to a printed circuit board.

Different manufacturers use several alternative names, abbreviations and package variants.

BGA package names and aliases

Abbreviation	Full name	Description
BGA	Ball Grid Array	Generic package with solder balls arranged in a grid underneath the body.
PBGA	Plastic Ball Grid Array	BGA with a plastic-based package construction, commonly using an organic substrate.
CBGA	Ceramic Ball Grid Array	BGA using a ceramic substrate for thermal stability and electrical performance.
FBGA	Fine-Pitch Ball Grid Array	Compact BGA with a finer ball pitch than conventional BGA packages.
FPBGA	Fine-Pitch Plastic Ball Grid Array	Fine-pitch BGA using plastic or organic package construction.
TFBGA	Thin Fine-Pitch Ball Grid Array	Thin-profile fine-pitch BGA commonly used in portable electronics.
VFBGA	Very Thin Fine-Pitch Ball Grid Array	Very thin BGA package designed for applications requiring a low profile.
UFBGA	Ultra Fine-Pitch Ball Grid Array	BGA with very fine ball spacing for compact, high-density designs.
WLCSP	Wafer-Level Chip-Scale Package	Chip-scale package manufactured at wafer level, often using a grid of solder balls.
WLBGA	Wafer-Level Ball Grid Array	BGA manufactured using wafer-level packaging techniques.
FCBGA	Flip-Chip Ball Grid Array	BGA using flip-chip die attachment for high-performance electrical and thermal characteristics.
FC-PBGA	Flip-Chip Plastic Ball Grid Array	Flip-chip BGA using an organic or plastic-based package substrate.
FCCBGA	Flip-Chip Ceramic Ball Grid Array	Flip-chip BGA using a ceramic substrate.
EBGA	Enhanced Ball Grid Array	BGA incorporating enhanced thermal or electrical characteristics, often with additional heat-dissipation features.
TBGA	Tape Ball Grid Array	BGA using a flexible tape-based substrate.
SBGA	Super Ball Grid Array	Manufacturer-dependent BGA designation; commonly associated with enhanced thermal performance.
LBGA	Low-Profile Ball Grid Array	BGA with reduced package height.
LFBGA	Low-Profile Fine-Pitch Ball Grid Array	Low-profile BGA with fine-pitch solder-ball connections.
MBGA	Micro Ball Grid Array	Miniaturised BGA designation, often associated with compact, fine-pitch packages.
µBGA	Micro Ball Grid Array	Alternative notation for micro-BGA; sometimes a manufacturer-specific trademark or package designation.
MAPBGA	Moulded Array Process Ball Grid Array	BGA manufactured using a moulded-array packaging process.
PoP	Package on Package	Stacked package arrangement often using BGA interconnections between packages.
SiP BGA	System-in-Package Ball Grid Array	BGA package integrating multiple semiconductor dies or components into one assembly.

Recommended naming for AutoTRAX DEX

For a parametric IC package database, I recommend using BGA as the primary package family, with the other names recorded as variants rather than automatically interchangeable aliases.

For example:

•Family: BGA

•Variant: FCBGA

•Full Name: Flip-Chip Ball Grid Array

•Mounting Type: Surface Mount

•Terminal Type: Solder Ball

•Ball Pitch: Manufacturer-dependent

•Ball Arrangement: Full grid, perimeter array or depopulated grid

•Ball Count: Manufacturer-dependent

Important: Some names describe package materials, some describe manufacturing methods, and others describe ball pitch or package height. Consequently, two packages may share a BGA designation while having completely different footprints