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PCB buried vias are a type of via used in printed circuit boards (PCBs) that are hidden or "buried" within the layers of the board. Unlike through-hole or blind vias, which are visible on the surface of the board, buried vias are located entirely within the internal layers of the board.

Buried vias are typically used in multilayer PCBs, where there are multiple layers of copper separated by layers of insulating material. By using buried vias, designers can create complex circuits that require multiple layers of copper without sacrificing board space or increasing the board's thickness.

The process of creating a buried via involves drilling a small hole into the board, typically using a laser or other specialized drilling tool, and then depositing a conductive material, such as copper, into the hole. This creates a connection between the different layers of copper within the board, allowing signals to pass between them.

One of the advantages of buried vias is that they can help to reduce signal interference and noise in a circuit. By keeping the via hidden within the layers of the board, there is less chance of interference from other components or external sources.

Overall, buried vias are an important feature of modern PCB design, allowing for complex, high-density circuits that are both reliable and efficient. They are used in a wide range of electronic applications, from consumer electronics to industrial control systems and medical devices.