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PCB blind vias are a type of via used in printed circuit boards (PCBs) that connect the outer layer of the board to one or more inner layers, but do not go all the way through the board. Blind vias are drilled from one side of the board only, and are typically used to connect surface-mount components on the top or bottom layer of the board to inner layers of the board.

Blind vias are useful in multilayer PCBs where there are multiple layers of copper separated by layers of insulating material. By using blind vias, designers can create complex circuits that require multiple layers of copper without sacrificing board space or increasing the board's thickness.

The process of creating a blind via involves drilling a small hole into the board from one side only, typically using a laser or other specialized drilling tool. The hole is then coated with a conductive material, such as copper, to create a connection between the different layers of copper within the board.

One of the advantages of blind vias is that they can help to reduce signal interference and noise in a circuit. By connecting only the necessary layers of copper within the board, there is less chance of interference from other components or external sources.

Overall, blind vias are an important feature of modern PCB design, allowing for complex, high-density circuits that are both reliable and efficient. They are used in a wide range of electronic applications, from consumer electronics to aerospace and defense systems.