How to Create a BGA PCB Footprint & 3D Model
Creating a BGA
Creating a Ball Grid Array (BGA) component can look rather intimidating. Rows and columns of tiny solder balls, precise dimensions, tight spacing and, of course, the prospect of routing all those connections afterwards.
Fortunately, AutoTRAX DEX can take much of the tedious work out of creating the component itself.
In this step-by-step tutorial, we'll use DEX's parametric component tools to create a BGA integrated circuit, complete with its PCB footprint, schematic symbol and automatically generated 3D model.
No need to draw hundreds of pads individually or spend an afternoon searching the internet for a suitable 3D model. There are more enjoyable ways to lose an afternoon.
WHAT YOU'LL LEARN
• How to create a parametric BGA component from the Home ribbon menu.
• How to select a BGA package from the parametric part library.
• How DEX previews the schematic symbol, PCB footprint and 3D model.
• How to open the package in the component editor.
• How to display the PCB footprint and 3D model side by side.
• How to use the Part Builder panel.
• How to adjust the number of solder-ball rows and columns.
• How to configure the BGA pad pitch.
• Why smaller pitches increase PCB routing and manufacturing complexity.
• How to add fiducials for automated component placement.
CREATING YOUR BGA COMPONENT
We'll begin by selecting Parametric Part from the Home ribbon menu.
DEX opens its library of configurable package types. Select the BGA package and you'll immediately see three previews.
The first shows the schematic symbol, the second displays the PCB footprint or land pattern, and the third shows the automatically generated 3D model.
All three are created from the package parameters.
There's no need to download a separate 3D model or create one using another CAD application.
CUSTOMISING THE BGA FOOTPRINT
Double-click the BGA package to open it in the editor.
Using the Panels ribbon, select PCB and 3D to display the footprint and 3D model in separate viewports.
Now open the Part Builder panel, where we'll explore the parameters that control the package geometry.
We'll change the number of rows and columns, which determines the number of solder balls, and examine the Pitch setting.
Pitch defines the distance between neighbouring solder balls. Reducing it allows more connections within a smaller area, although it also makes PCB manufacturing and routing more challenging.
It's a familiar engineering problem: making everything smaller is easy enough until you discover that everything else needs to become smaller too.
ADDING FIDUCIALS
We'll also examine the option to add fiducials.
These small alignment markers help automated pick-and-place machines position components accurately during assembly.
They're particularly useful for fine-pitch components where even small placement errors can cause problems.
WHY USE PARAMETRIC COMPONENTS?
DEX generates the schematic symbol, PCB footprint and 3D model from a common set of parameters.
This makes it much easier to experiment with different package dimensions and understand how the physical component will appear on your PCB.
And because the 3D model is generated automatically, you can concentrate on the electronics rather than becoming an unwilling expert in 3D modelling.
YOUTUBE CHAPTERS
00:00 Introduction — Creating a BGA Component
00:31 Opening the Parametric Part Library
00:51 Selecting the BGA Package
01:08 Previewing the Schematic Symbol
01:26 PCB Footprint and Automatically Generated 3D Model
01:53 Opening the BGA Component Editor
02:28 Displaying PCB and 3D Views
03:04 Opening the Part Builder Panel
03:20 Customising the BGA Parameters
03:51 Adjusting BGA Pitch
04:17 Adding Fiducials
04:50 Reviewing the Completed BGA Package