SOT-223
SOT-223 is a type of package used for semiconductors, such as transistors and integrated circuits. The acronym "SOT" stands for Small Outline Transistor, and the number "223" refers to the specific form factor or physical dimensions of the package.
The package has three leads coming out from the bottom and an additional heat sink tab for better thermal dissipation. This is useful in applications where the device needs to dissipate a considerable amount of heat, such as power transistors.
SOT-223 packages are commonly used in surface-mount technology, which allows for high-density PCB (printed circuit board) assembly and automation-friendly manufacturing processes. Their design makes them compact and efficient, fitting well into modern electronic device design philosophies that prioritize space efficiency and power management.
For specific measurements or pin configuration of the SOT-223 package, you would need to refer to the data-sheet of the particular component you are using, as these details can vary between manufacturers or even between different devices from the same manufacturer.